The idea: push streams of water right through a chip
Science-lovers, working from IBM labs and the Fraunhofer Institute in Berlin, have come up with a great idea for cooling CPUs. While cooling the surface of CPU using water has been around for a while now, new research pushes this concept one step further: in a working prototype, water cools the CPU, from the inside.
Basically, this CPU designs calls for multiple layers of silicon. Between the layers, water is piped through. “As we package chips on top of each other to significantly speed a processor’s capability to process data, we have found that conventional coolers attached to the back of a chip don’t scale. In order to exploit the potential of high-performance 3-D chip stacking, we need interlayer cooling,” Thomas Brunschwiler, project leader at IBM’s Zurich Research Laboratory, was quoted as saying. “Until now, nobody has demonstrated viable solutions to this problem.”
Proper cooling is certainly a big problem in keeping up with the exponential increases in computational power and transistor density. While today's coolers are very efficient, their is only so much you can do with working with the surface of the CPU. With future CPU designs looking like they may incorporate on-chip memory, as well as multiple graphics cores, this new design breakthrough seems like it could be the way forward.
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