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Forget DDR3, PRAM is where it's at.
J. Micah Grunert - Monday, August 13th, 2007 | 11:14AM (PT)


Phase change memory, still a fews years away, could become the fastest memory we would ever know.

Years ago, I had a stack of archaic 5 1/4" floppy disks (still have some for some old Apple II computers). Then, the slightly small, added capacity of 3 1/2" disks (there's dozens kicking around my desk at home). CD's and DVD's consume two boxes (I should sort them). And now I'm collecting thumb drives (four with 7 GB of storage in total).

But there may come one storage technology to defeat them all; Phase Change memory. Developed by the Lithuanian-American scientist Stanford R. Ovshinsky back in the 1960's, PRAM (a.k.a. PCM, PRAM, PCRAM, Ovonic Unified Memory and Chalcogenide RAM C-RAM) relies on the physical change of a material to hold data, rather than the conventional storage of electrons, switching of transistor like gates, or the magnetic mediums we are familiar with today.

Using Chalcogenide glass (a type of glass containing either sulfur, selenium or tellurium), it becomes possible with electrical currents to change the physical structure of the glass from crystalline (structured) to amorphous (non-structured), and back again.

Both Intel and STMicroelectronics have been working towards PRAM memory in the hopes of unlocking its distinctive advantages over that of conventional memory. Phase change memory has been clocked in laboratory settings at nearly 100,000 times faster than conventional memory specs. It also claims faster write speeds at 1ms to 10ns per byte of data. Furthermore, the MTBF (MeanTimeBetweenFailure) is on the order of 100,000,000 writes per sector, where as regular flash memory can only withstand 10,000 to 100,000 writes per sector before signs of failure.

There are a couple of short comings to Phase Change memory though. First, since it is made out of the same materials that comprise the recordable medium upon CD's and DVD's, the compounds used must be heated to 600 Celsius and above to create enough convection turbulence within the material to have it become amorphous. Furthermore, higher than normal voltages are required for both the read and write phase of the memory. Significant obstacles to overcome, but ones that can be greatly reduced with further refinement and research.

Perhaps Phase Change memory will never make it to portable devices such as digital cameras, thumb drives and media player. But there of course will be a home for it in PC's and Servers that demand faster memory performance. Now all that remains is for the chipset designers to increase FSB speeds to stay on par with future memory speeds. 

Sorry, the first Phase Change memory launch is still a few years away.

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Comments:

August 13th, 2007 1:17PM(PT)
tallteen86
Sounds good, but those obstacles are pretty signifigant, particularly the temperature one...

Maybe we'll have something similar for thumbdrives and stuff, in the future, albiet, not as fast I'm sure...
September 9th, 2007 3:02PM(PT)
DG
How the hell would you heat a component inside your pc to 600 Centigrade? Especially without destroying every OTHER component of the system?! Just imagine the power it would need. Sounds like a pretty stupid idea to me, I have to say.
September 10th, 2007 2:48AM(PT)
MicahWrites
It's not the functioning of the PRAM that requires higher temperatures but the construction that requires that the materials used be heated to 600 Deg Celc plus for the compound to be truly homogeneous.
September 10th, 2007 5:42PM(PT)
Cillchaoi
Actually, Micah, if you look again, you will see that the article above (if the facts are stated correctly) says that the 600C temperature is required "...to create enough convection turbulence within the material to have it become amorphous." Changing the glass to an amorphous state is the way to change the state of that bit of data to a non-structured (presumably blank or zero) state. Thus, the temperature would need to be created inside the computer. However, if it is done in sufficiently small enough quantities, the amount of heat produced by this new style of memory could be minimized with an efficient heatsink and attached fan or water cooler or other method of dissipating the heat. If it were to be in sticks similar in size to what we have now, then I would say it would not be feasible. Presumably, though, the sticks would be smaller because chances are that the density of data could be much higher and, thus, more storage could be crammed into less media.

Time will tell what happens with this new technology (if anything).
September 10th, 2007 6:04PM(PT)
MicahWrites
That 600 Degree Celsius temperature is what is required endow the crystal with its phase change characteristics. Once the material have undergone this transformation it can then be built into PRAM. When the PRAM is being written to (reading will require very little voltage), the actual temperatures required to shift the crystal from conductive to non-conductive will be far less than 600 degrees at the state of the material in question will have been endowed with the Phase Change characteristics necessary.

But if you think about it, you can weld with an arc of of 5000 degrees and burn your self, but a piezo electric arc from an electric lighter can weld a couple of atoms of iron together. The voltages in PRAM won't be at the 110V 30Amp level. The small amount of electrons needed to instigate that change will have a high temperature but will be switching memory gates less than 100nm in diameter, if not less than 50.

Feel free to read this Wikipedia page I had referenced whilst writing my above article on PRAM.

http://en.wikipedia.org/wiki/Phase-change_memory

Besides, battery life would go out the window if PRAM had to be boiled into state thousands of time a second in your digital camera.

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